Hebei General Metal Netting Co.,Ltd.

Copper Foam

Copper foam is a new type of multifunctional material with a large number of connected or unconnected holes evenly distributed in the copper matrix. The copper foam has good conductivity and ductility, and its preparation cost is lower than that of nickel foam, and its conductivity is better.

Copper foam technical parameters:
Material: copper
Aperture: 0.1mm-10mm
Porosity: 60%-98%
Through hole rate: ≥98%
Bulk density: 0.1-0.8g/cm³
Ppi (number of holes per inch): 5-130
Size: 600*600MM, it can be customized upon request.

Application:
Copper foam is used as the base material for the battery as an electrode, but it has some obvious advantages, but because copper's corrosion resistance is not as good as nickel, it also limits its application.It can be used to prepare battery negative electrode (carrier) material, catalyst carrier and electromagnetic shielding material.